Tool Loadport Station(TLP)
For non-vacuum environments housing wafers, a positive pressure and closed-loop control system are employed for purging, utilizing the fab's power system (N2/XCDA). For the first time in China, MeetFuture's TLP1.0 has significantly reduced the humidity of FOUP to below RH1% in a remarkably short time.

Optional configuration: Standard position sensor, temperature and humidity sensor, pressure gauge, flowmeter, optional MFC
Feature Highlights:

User-friendly man-machine interface

Stable system integration

Stand-alone control board

High-speed purge

Compatibility with multiple EAP communications

Software Description
TLP Software
TLP Software
An intelligent, efficient, stable, and professional host software, coupled with a customized purging strategy and comprehensive status monitoring, ensures the cleanliness and humidity stability within the wafer cassette, thereby preserving the wafer's characteristics and quality.

Feature Highlights:
▪ Supports standard three-stage purging control.
▪ With FabScope, it can display the current operational status information of all equipment.
Important Parameters
Technical IndicatorsParameters
Clean Grade≤Class100
Filtration Precision0.003um
Power Source220V,50Hz,2A


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